Transient two dimensional heat conduction by orthogonal collocation technique

P. Sangsurasak, D. A. Mitchell, M. Hossain

Research output: Contribution to journalArticlepeer-review

5 Citations (Scopus)

Abstract

Orthogonal collocation is used to solve a simple transient two-dimensional heat transfer problem in which a cylinder cools through conduction at its ends and convection from its side. Orthogonal collocation represents a useful technique for solution of such problems and can easily be adapted to more complex problems.

Original languageEnglish
Pages (from-to)557-566
Number of pages10
JournalInternational Communications in Heat and Mass Transfer
Volume20
Issue number4
DOIs
Publication statusPublished - 1993
Externally publishedYes

ASJC Scopus subject areas

  • Atomic and Molecular Physics, and Optics
  • Chemical Engineering(all)
  • Condensed Matter Physics

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