Thermohydraulic Performance of Heat Sink with Sinusoidal Microchannels Embedded with Pin-Fins for Liquid Cooling of Microelectronic Chips

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

This article details the mathematical modeling of a heat sink employing sinusoidal microchannels, embedded with pin-fins, for purposes of liquid cooling of microelectronic chips. The performance of the heat sink is quantified in terms of thermal resistance and pumping power. Studies are done for Reynolds number varying from 250 to 1500. The thermal resistance decreases with increase in Reynolds number while the pumping power increases with increase in Reynolds number. The thermal resistance of the heat sinks with sinusoidal microchannel embedded with pin-fins is much smaller than that of heat sinks with straight microchannels as well as sinusoidal microchannels; however, the pumping power of the former is higher than the other two microchannels. For the cases studied, the reduction in thermal resistance of sinusoidal microchannels embedded with pin fins varied from 21% to 57% compared with that of straight microchannels. Studies revealed that changes in the diameter of pin fin and amplitude of sinusoidal microchannel have noticeable influence on thermal resistance at low Reynolds number but with increase in Reynolds number, the influence of diameter on thermal resistance waned. On the other hand, increase in diameter of the pin fin as well as increase in the amplitude and frequency of the sinusoidal microchannel increased the pumping power for all Reynolds number.

Original languageEnglish
Title of host publication37th Annual Semiconductor Thermal Measurement, Modeling and Management Symposium, SEMI-THERM 2021 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages65-71
Number of pages7
ISBN (Electronic)9781735532516
Publication statusPublished - Mar 22 2021
Event37th Annual Semiconductor Thermal Measurement, Modeling and Management Symposium, SEMI-THERM 2021 - Virtual, San Jose, United States
Duration: Mar 22 2021Mar 26 2021

Publication series

Name37th Annual Semiconductor Thermal Measurement, Modeling and Management Symposium, SEMI-THERM 2021 - Proceedings

Conference

Conference37th Annual Semiconductor Thermal Measurement, Modeling and Management Symposium, SEMI-THERM 2021
Country/TerritoryUnited States
CityVirtual, San Jose
Period3/22/213/26/21

Keywords

  • Liquid cooling
  • pin fin
  • pumping power
  • sinusoidal microchannel
  • thermal resistance

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Modelling and Simulation
  • Fluid Flow and Transfer Processes
  • Electrical and Electronic Engineering

Fingerprint

Dive into the research topics of 'Thermohydraulic Performance of Heat Sink with Sinusoidal Microchannels Embedded with Pin-Fins for Liquid Cooling of Microelectronic Chips'. Together they form a unique fingerprint.

Cite this