Thermo-hydraulic characteristics of novel MEMS heat sink

Vaibhav Hotchandani, Bobby Mathew, Sumith Yesudasan, Sibi Chacko

Research output: Contribution to journalArticlepeer-review

4 Citations (Scopus)

Abstract

This article details the analysis of the thermo-hydraulic performance of a single-phase MEMS Heat sink with pin fins integrated in micro channels. Circular pin-fins with in-line arrangement are considered in this study. The influence of operating and geometric parameters on the performance, (thermal resistance and pressure drop) are studied; the parameters considered include microchannel hydraulic diameter, microchannel spacing, substrate material, pin-fin pitch, and Reynolds number. Additionally, the performance is quantified in terms of a Figure of Merit (FOM) which is the product of normalized thermal resistance and normalized pressure drop. The thermal resistance of heat sink with pin-fin integrated in micro channels is lower than that in heat sinks without pin-fins irrespective of the Reynolds number. On the other hand, the pressure drop associated with heat sink with pin-fins integrated in microchannel is higher than that in heat sinks without pin-fins for all Reynolds number. Also, increase in hydraulic diameter leads to reduction in thermal resistance and increase in pressure drop for a specific Reynolds number. On the other hand, reduction in microchannel spacing leads to reduction in thermal resistance for a specific Reynolds number; the pressure drop is independent of the microchannel spacing. With regards to the influence of substrate material, the thermal resistance decreased with increase in thermal conductivity; the pressure drop is not influenced by changes in substrate material.

Original languageEnglish
Pages (from-to)145-157
Number of pages13
JournalMicrosystem Technologies
Volume27
Issue number1
DOIs
Publication statusPublished - Jan 2021

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Hardware and Architecture
  • Electrical and Electronic Engineering

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