Tenacious hardware trojans due to high temperature in middle tiers of 3-D ICs

Syed Rafay Hasan, Siraj Fulum Mossa, Omar Sayed Ahmed Elkeelany, Falah Awwad

Research output: Chapter in Book/Report/Conference proceedingConference contribution

18 Citations (Scopus)

Abstract

Hardware security is a major concern in the intellectual property (IP) centric integrated circuits (IC). 3-D IC design augments IP centric designs. However, 3-D ICs suffer from high temperatures in their middle tiers due to long heat dissipation paths. We anticipate that this problem would exacerbate the hardware security issues in 3-D ICs. Because, high temperature leads to undesired timing characteristics in ICs. In this paper we provide a detailed analysis on how these delay variations can lead to non-ideal behavior of control paths. It is demonstrated that a hardware intruder can leverage this phenomenon to trigger the payload, without requiring a separate triggering circuit. Our simulation results show that a state machine can lead to temporary glitches long enough to cause malfunctioning at temperatures of 87°C or above, under nominal frequencies. The overall area overhead of the payload compared to a very small Mod-3 counter is 6%.

Original languageEnglish
Title of host publicationMidwest Symposium on Circuits and Systems
PublisherInstitute of Electrical and Electronics Engineers Inc.
Volume2015-September
ISBN (Print)9781467365574
DOIs
Publication statusPublished - Sep 28 2015
Event58th IEEE International Midwest Symposium on Circuits and Systems, MWSCAS 2015 - Fort Collins, United States
Duration: Aug 2 2015Aug 5 2015

Other

Other58th IEEE International Midwest Symposium on Circuits and Systems, MWSCAS 2015
Country/TerritoryUnited States
CityFort Collins
Period8/2/158/5/15

Keywords

  • 3-D IC
  • hardware Trojan
  • high temperature

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

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