Loop heat pipe (LHP) development by utilizing coherent porous silicon (CPS) wicks

M. Hamdan, D. Cytrynowicz, P. Medis, A. Shuja, F. M. Gerner, H. T. Henderson, E. Golliher, K. Mellott, C. Moore

Research output: Chapter in Book/Report/Conference proceedingConference contribution

36 Citations (Scopus)

Abstract

This paper introduces a theoretical model for a Loop Heat Pipe (LHP) utilizing a coherent porous silicon (CPS) wick. The paper investigates the effects of different parameters on the performance of the LHP such as evaporator temperature, condenser temperature, total mass charge, wick thickness, porosity, and pore size. A LHP is a two-phase device with extremely high effective thermal conductivity that uses capillary forces developed inside its wicked evaporator to pump a working fluid through a closed loop. The loop heat pipe is developed to efficiently transport heat that is generated by a highly localized concentrated heat source and then to discharge this heat to a convenient sink. This device is urgently needed to cool electronic components, especially in space applications. The LHP has been modeled utilizing the conservation equations and thermodynamic cycle. The loop heat pipe cycle is presented on a T-s diagram. A direct relation is developed between the ratio of heat going for evaporation as well as heat leaking to the compensation chamber.

Original languageEnglish
Title of host publicationITHERM 2002 - 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
EditorsBahgat G. Sammakia, Yogendra K. Joshi, Ganesh Subbarayan, Cristina H. Amon, Koneru Ramakrishna, Sanjeev B. Sathe
PublisherIEEE Computer Society
Pages457-465
Number of pages9
ISBN (Electronic)0780371526
DOIs
Publication statusPublished - Jan 1 2002
Event8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM 2002 - San Diego, United States
Duration: May 30 2002Jun 1 2002

Publication series

NameInterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM
Volume2002-January
ISSN (Print)1936-3958

Other

Other8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM 2002
Country/TerritoryUnited States
CitySan Diego
Period5/30/026/1/02

Keywords

  • Electronic components
  • Equations
  • Fault location
  • Heat sinks
  • Pumps
  • Silicon
  • Space cooling
  • Temperature
  • Thermal conductivity
  • Thermal force

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

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