Effect of underfill epoxy on mechanical behavior of flip chip assembly

Wenge Zhang, Derick Wu, Bingzhi Su, Saeed Hareb, Y. C. Lee, Pat Masterson

Research output: Contribution to journalConference articlepeer-review

5 Citations (Scopus)

Abstract

The thermally-induced warpage is measured on both real flip chip thermosonic bonded assembly and simulated trilayered assembly to study the underfill epoxy effects on mechanical behavior of assembly. The mechanical behavior is characterized by the curing temperature when the maximum temperature is less than the glass transition temperature (Tg). When the maximum temperature is higher than Tg, the behavior is characterized by Tg regardless how high the temperature is. From the different characteristic temperatures of curing and glass transition, the warpage as well as the Von Misses stress could increase by as much as factor of two, which could affect the device reliability for RF packages and alignment for optoelectronic packages.

Original languageEnglish
Pages (from-to)1170-1175
Number of pages6
JournalProceedings - Electronic Components and Technology Conference
Publication statusPublished - 1997
EventProceedings of the 1997 47th IEEE Electronic Components & Technology Conference - San Jose, CA, USA
Duration: May 18 1997May 21 1997

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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